Realme X50 is the first 5G smartphone from Realme and is tipped to launch in January 2020. The device is already confirmed to sport Qualcomm’s latest Snapdragon 765G processor that has integrated 5G modem and supports dual-mode 5G. Today, the company took to Weibo to announce another key specification of the upcoming Realme X50.
According to the post put on Weibo, the Realme X50 comes with a liquid cooling feature that is answered by an 8mm ultra-large diameter liquid-cooled copper tube. The company says that the technology uses five-dimensional ice-cooled heat dissipation and has 100% coverage of core heat sources. All this is particularly useful while playing high graphic games which puts the load on CPU and GPU.
Yesterday, Realme announced that the Realme X50 device will simultaneously connect WiFi and 5G networks which is aided by the X52 model present in the Snapdragon 765G. This kind of dual connectivity is already present in 4G smartphones. Apart from this, the Realme X50 is capable of connecting to 2.4GHz and a 5GHz Wi-Fi network simultaneously.
The Realme X50 is already confirmed to sport a 120Hz display. We will also see the Pro variant of the Realme X50 in Q1 2020 in China with Snapdragon 865 processor and 120Hz display. The device will take on the likes of Redmi K30, Honor V30, Vivo X30 5G smartphones which were launched in China recently.